Coupling structures for electronic device housings

ABSTRACT

A housing for an electronic device is disclosed. The housing comprises a first component and a second component separated from the first component by a gap. The housing also includes a first molded element disposed at least partially within the gap and defining at least a portion of an interlock feature, and a second molded element disposed at least partially within the gap and mechanically engaging the interlock feature. The first component, the second component, and the second molded element form a portion of an exterior surface of the housing. A method of forming the housing is also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a nonprovisional patent application of and claimsthe benefit of U.S. Provisional Patent Application No. 62/214,558, filedSep. 4, 2015 and titled “Coupling Structures for Electronic DeviceHousings,” the disclosure of which is hereby incorporated herein byreference in its entirety.

FIELD

The subject matter of this disclosure relates generally to couplingstructures for electronic device housings, and more particularly tocoupling structures for joining housing components with molded polymermaterials.

BACKGROUND

Electronic device housings often include multiple components that arecoupled together to form the housing. For example, two or more housingportions may be coupled together to form an outer surface of the housingand to form an interior cavity in which components of the electronicdevice are housed. For different materials and more complex geometries,existing techniques for coupling housing portions may not be suitablefor creating bonds of sufficient strength between components, and maynot be capable of producing a surface finish and appearance necessaryfor exterior surfaces of an electronic device housing.

SUMMARY

Described herein are structures for coupling housing components ofelectronic device housings. For example, as described herein, a polymermaterial may be molded or otherwise disposed between two or more housingcomponents to form a molded polymer element that couples the housingcomponents together. The housing components may include variousinterlock features that mechanically engage with the molded element inorder to form a secure coupling between the housing components and themolded element. The molded element may include portions made ofdifferent materials to benefit from the properties of each differentmaterial. For example, a first polymer material having a high strengthmay be used to form one portion of the molded element, while a secondpolymer material that is more easily polished or that forms a smootherouter surface may be used for a portion of the molded element that formspart of an exterior surface of the housing.

Some embodiments provide a housing for an electronic device. The housingincludes a first component and a second component separated from thefirst component by a gap. The housing also includes a first moldedelement disposed at least partially within the gap and defining at leasta portion of an interlock feature, and a second molded element disposedat least partially within the gap and mechanically engaging theinterlock feature. The first component, the second component, and thesecond molded element form a portion of an exterior surface of thehousing.

Some embodiments provide a housing for an electronic device. The housingincludes a first component, a second component separated from the firstcomponent by a gap, and a joint structure disposed at least partiallywithin the gap. The first component and the second component compriseflanges defining first and second portions, respectively, of a frameadapted to receive a transparent cover. A tooth of the joint structureextends past a ledge of the joint structure and forms a third portion ofthe frame. The joint structure includes a support structure thatsupports the tooth.

Some embodiments provide a housing for an electronic device. The housingincludes a first housing portion forming a first portion of an exteriorsurface of the housing, and a second housing portion separated from thefirst housing portion by a gap and forming a second portion of anexterior surface of the housing. The housing further includes a moldedelement disposed in the gap and comprising a guide structure configuredto bias at least a portion of the molded element toward an interior ofthe housing in response to a narrowing of the gap.

Some embodiments provide a method of forming a housing for an electronicdevice. The method includes forming a first molded element by flowing amaterial into a gap between a first housing component and a secondhousing component, flowing the material against a first interlockfeature of the first housing component to couple the material to thefirst housing component, and flowing the material against a secondinterlock feature of the second housing component to couple the materialto the second housing component. The method further includes forming asecond molded element in the gap to form an exterior surface of theelectronic device.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure will be readily understood by the following detaileddescription in conjunction with the accompanying drawings, wherein likereference numerals designate like structural elements, and in which:

FIG. 1 shows an example electronic device;

FIG. 2 shows a back of the example electronic device of FIG. 1;

FIG. 3 shows an exploded view of an example electronic device housing;

FIG. 4 shows a portion of an example electronic device housing;

FIG. 5 shows a back of the electronic device housing of FIG. 4;

FIG. 6 shows the electronic device housing of FIG. 4;

FIG. 7 shows a partial cross-sectional view of the electronic devicehousing of FIG. 4 taken along line 7-7 in FIG. 4;

FIG. 8 shows a partial cross-sectional view of the electronic devicehousing of FIG. 4 taken along line 8-8 in FIG. 4;

FIG. 9 shows an expanded view of a portion of the electronic devicehousing shown in region 415 of FIG. 4;

FIG. 10 shows a partial cross-sectional view of an embodiment of theelectronic device housing of FIG. 4 taken along line 10-10 in FIG. 6,showing an interlock feature that includes a protrusion;

FIG. 11 shows a partial cross-sectional view of the embodiment of theelectronic device housing of FIG. 10 taken along line 11-11 in FIG. 10;

FIG. 12 shows a partial cross-sectional view of another embodiment ofthe electronic device housing of FIG. 4 taken along line 10-10 in FIG.6, showing an interlock feature that includes a protrusion with athrough-hole;

FIG. 13 shows a partial cross-sectional view of the embodiment of theelectronic device housing of FIG. 12 taken along line 13-13 in FIG. 12;

FIG. 14 shows a partial cross-sectional view of yet another embodimentof the electronic device housing of FIG. 4 taken along line 10-10 inFIG. 6, showing an interlock feature that includes a recess;

FIG. 15 shows a partial cross-sectional view of yet another embodimentof the electronic device housing of FIG. 4 taken along line 10-10 inFIG. 6, showing an interlock feature that includes a slot;

FIGS. 16A-16C show partial cross-sectional views of yet anotherembodiment of the electronic device housing of FIG. 4 taken along line10-10 in FIG. 6, showing an interlock feature that includes a taperedthrough-hole;

FIGS. 17A-17C show partial cross-sectional views of yet anotherembodiment of the electronic device housing of FIG. 4 taken along line10-10 in FIG. 6, showing an interlock feature that includes a threadedhole;

FIG. 17D shows a partial cross-sectional view of yet another embodimentof the electronic device housing of FIG. 4 taken along line 10-10 inFIG. 6, showing multiple interlock features;

FIGS. 18-20C show partial exploded views of the electronic devicehousing of FIG. 4, showing various embodiments of a guide structure fora molded element;

FIG. 21A shows a partial exploded view of the electronic device housingof FIG. 4, showing a molded element that includes an example gusset;

FIG. 21B shows a partial view of the molded element of FIG. 21A;

FIG. 22A shows a partial exploded view of the electronic device housingof FIG. 4, showing a molded element that includes another examplegusset;

FIG. 22B shows a partial view of the molded element of FIG. 22A;

FIG. 23A shows a partial view of the electronic device housing of FIG.4, showing a molded element with a chamfer;

FIG. 23B shows a partial view of the molded element of FIG. 23A; and

FIG. 24 is a flow chart of a method of forming a housing for anelectronic device.

DETAILED DESCRIPTION

Reference will now be made in detail to representative embodimentsillustrated in the accompanying drawings. It should be understood thatthe following descriptions are not intended to limit the embodiments toone preferred embodiment. To the contrary, it is intended to coveralternatives, modifications, and equivalents as can be included withinthe spirit and scope of the described embodiments as defined by theappended claims.

Housings for electronic devices may be made up of multiple differentcomponents. For example, a housing may include a first component thatforms a back surface of the housing, a second component that forms aside or edge of the housing, and so on. In order to join the first andsecond components (for example), a polymer material (or other suitablematerial) may be molded in or into a gap between the components. Inorder to produce a suitably strong coupling between the components, thefirst and second housing components include interlock features withwhich the polymer material engages. The polymer material may be moldedinto the gap in a viscous or flowable state such that it flows into,surrounds, and/or otherwise engages the interlock features of thehousing components. Once the polymer material hardens, the engagementbetween the polymer material and the interlocks securely couples thehousing portions together. An interlock (or interlock feature) is astructure or feature that engages another structure or feature to retaina component to one or more other components. Interlocks may include, forexample, threads (e.g., threaded posts, holes, or other surfaces),undercuts, dovetails, grooves, protrusions, notches, channels, or thelike.

The gaps between housing components may be configured such that thematerial within the gap forms part of the exterior surface. For example,joint structures may be disposed in gaps between housing components, andmay be part of the exterior surface of the housing. In some cases, amaterial that is suitable for structurally joining housing components isnot ideal for forming an exterior surface of the housing, and viceversa. As one non-limiting example, whereas strength and rigidity may beimportant properties for a joining material, surface finish and chemicalresistance may be equally or more important for a material that willform part of an exterior surface of the housing. Accordingly, multiplematerials may be molded into a gap, and each material may be selected tosatisfy a particular design constraint or requirement. For example, afirst material may be molded into the gap to structurally couple thehousing components. A second material may then be molded into the gap,over the first material, to form part of an exterior surface of thehousing. By using multiple materials in a gap, the materials can each beoptimized for specific purposes and/or characteristics.

In the following figures and description, similar instances ofparticular components or features may be designated by additionalindicators appended to the element number. For example, particularinstances of first molded elements may be designated 400-1, 400-2, etc.References to an element number without any additional indicator (e.g.,the first molded elements 400) apply to any or all instances of thatcomponent or feature, and references to an element number with anadditional indicator (e.g., the first molded element 400-1) apply to aparticular instance of that component or feature. Moreover, anydiscussion related to an individual instance of a component or feature(e.g., the first molded element 400-1) may also apply to other instancesof that component (e.g., the first molded element 400-2).

FIG. 1 shows an example electronic device 100 embodied as a smartphone.While the device 100 is a smartphone, the concepts presented herein mayapply to any appropriate electronic, including wearable devices (e.g.,watches), laptop computers, handheld gaming devices, tablet computers,computing peripherals (e.g., mice, touchpads, keyboards), or any otherdevice. Accordingly, any reference to an “electronic device” encompassesany and all of the foregoing.

The electronic device includes a cover 102, such as a glass, plastic, orother substantially transparent material, component, or assembly,attached to a housing 104. As shown, the housing 104 can be amulti-piece housing. For example, the housing 104 can be formed from abody portion 200 and end portions 202, 204 (FIG. 2). The device 100 alsoincludes internal components, such as processors, memory, circuitboards, batteries, sensors, and the like. Such components, which are notshown, may be disposed within an interior volume defined at leastpartially by the housing 104.

FIG. 2 shows a back view of the device 100. The housing 104 includes abody portion 200 and end portions 202, 204 (also referred to herein as atop portion 202 and a bottom portion 204). The body portion 200 and theend portions 202, 204 may be formed from any appropriate material, suchas aluminum, titanium, amorphous metals, polymer, or the like.

The housing 104 also includes a joint structure 206-1 between the bodyportion 200 and the top portion 202, and a joint structure 206-2 betweenthe body portion 200 and the bottom portion 204. Joint structures arestructures that couple and/or retain one component to another component.For example, the joint structures 206 couple the end portions 202, 204to the body portion 200, as described herein. The joint structures 206may include multiple layers and/or portions, each of which may be formedfrom any appropriate material. For example, joint structures or portionsthereof may be formed from polymers such as nylon, polyether etherketone, polysulfone, polyphenylsulfone, polyaryletherketone,polyetherimide, polyethersulfone, or any other appropriate material.Moreover, the joint structures 206 may be reinforced with reinforcingfibers of glass, carbon, ceramics, or any other appropriate material.

The housing 104 also includes a first panel 210 and a second panel 212.As shown in FIG. 3, the first and second panels 210, 212 are part of thebody portion 200 (e.g., the first and second panels 210, 212 and thebody portion 200 are a monolithic structure). For example, as shown inFIG. 3, bridge portions 300, 302 join the first and second panels 210,212, respectively, to the body portion 200. Alternatively, the first andsecond panels 210, 212 may be separate from the body portion 200. Insuch cases, the joint structures 206 may couple the panels 210, 212 tothe body portion 200.

Returning to FIG. 2, exterior surfaces of the joint structures 206 mayform a continuous surface with exterior surfaces of the housing 104.Alternatively, the exterior surfaces of the joint structures 206 may berecessed from or proud of portions of the housing that are adjacent thejoint structures 206. Further, the exterior surfaces of the jointstructures 206 may be configured to blend in with other portions of thehousing 104. For example, the joint structures 206 may be the same coloras nearby portions of the housing 104, may have the same surfacefinish/texture as exterior portions of the housing 104, or the like. Thejoint structures 206 may also be formed from the same material as thebody portion 200 and the end portions 202, 204. In some cases, however,the joint structures 206 have a different color or surface finish thanexterior portions of the housing 104.

The body portion 200 and/or the end portions 202, 204 may be part of anelectrical circuit of the device 100. For example, one or both of theend portions 202, 204 may be an antenna, or a portion of an antenna, forwireless communication (e.g., cellular, Wi-Fi, Bluetooth, and so on).Where an end portion is an antenna, or is otherwise part of anelectrical circuit, it may be necessary or desirable to electricallyand/or capacitively isolate one or both of the end portions from otherportions of the housing 104, such as the body portion 200. Accordingly,the joint structures 206 may be formed from an electrical insulator thatelectrically and/or capacitively isolates and/or insulates the housingcomponents from each other while also coupling them together to form astructurally sound housing 104.

FIG. 3 shows a partial exploded view of the housing 104, with the endportions 202, 204 separated from the body portion 200. As describedherein, the joint structures 206 (shown in FIG. 2, not shown in FIG. 3)couple the end portions 202, 204 to the body portion 200. Also shown inFIG. 3 are bridge portions 300, 302 that join the first and secondpanels 210, 212, respectively, to the body portion 200. The bridgeportions 300, 302 are recessed relative to an exterior surface of thebody portion 200, forming grooves in the body portion 200 that receiveportions of the joint structures (e.g., the second molded elements 600,FIG. 6).

FIGS. 4-6 show various views of an embodiment of the housing 104 inwhich the joint structures 206 each include two molded elements. Forexample, with reference to FIGS. 4-5, first molded elements 400 (e.g.,400-1 and 400-2) are disposed at least partially within gaps between thetop and bottom portions 202, 204 and the body portion 200, and couplethe top and bottom portions 202, 204 to the body portion 200. The moldedelements described herein may be formed by molding (including, forexample, injecting) a material into the gaps between components of thehousing 104. However, the molded elements, or portions thereof, may beformed in other ways as well, and are not necessarily limited to anyparticular manufacturing or forming process. For example, one or more ofthe molded elements may be formed separately from the housing 104 (usingany appropriate process, such as extruding, machining, or the like) andpositioned in the gaps after the molded elements are formed.

As shown in FIGS. 4 and 5, the first molded elements 400 do not extendto the exterior surfaces of the housing 104. Rather, the first moldedelements 400 only partially fill the gaps between the housing portions,leaving recesses 414 (e.g., 414-1 and 414-2, FIG. 5) into which secondmolded elements 600 (e.g., 600-1 and 600-2, FIG. 6) are then formed,filling the remaining portions of the gaps and forming part of theexterior surface of the housing 104. FIGS. 4-5 show the housing 104 withonly the first molded elements 400 disposed in the gaps between thehousing portions. FIG. 6 shows the front of the housing 104 with boththe first molded elements 400 and the second molded elements 600 formedin the gaps.

The first molded elements 400 may couple the housing portions togetherby mechanically engaging with interlock features of the housingportions, as described herein. The second molded elements 600 couple tothe housing 104 (and/or to the first molded elements 400) bymechanically engaging with interlock features of the housing 104 and/orthe first molded elements 400, as discussed herein.

While the molded elements are described herein as being formed in orwithin the gaps between housing components, the molded elements mayextend beyond the gaps and may couple to, cover, lie flush with, orotherwise engage with other portions of the housing 104. For example, asillustrated in FIG. 4, the first molded elements 400 include portionsthat cover part of an interior surface of the housing 104. Thus, someportions of the molded elements may be disposed within gaps betweenhousing components, whereas other portions are disposed outside thegaps. Moreover, the molded elements of each joint structure 206 areshown and described as being single, monolithic components. More moldedelements (e.g., several discrete molded elements) may be used to formany joint structure 206, however.

As noted above, the first and second molded elements may each benefitfrom, or otherwise employ, a different set of material properties. Forexample, the first molded elements 400 may provide the primary (or sole)mechanical coupling between housing portions. Accordingly, a materialhaving a high yield strength, stiffness, and/or toughness (as comparedto the material for the second molded elements 600, or even the housing104, for example) may be selected to create the first molded elements400. Additionally, the housing 104 may be subjected to certainprocessing steps after the housing portions are joined by the firstmolded elements 400, such as anodizing, annealing, or the like. In suchcases, a material that is able to resist degradation or damage whensubjected to anodizing, heating, or other chemical or physical processesmay be selected for the first molded elements 400. For example, thefirst molded elements 400 may be formed from glass fiber reinforcednylon, glass fiber reinforced polyether ether ketone, or the like.

Different material properties may be useful for the second moldedelements 600. For example, because the second molded elements 600 formpart of the exterior surface of the housing 104, a material having ahigh chemical resistance may be selected, so that the material does notdegrade when it comes into contact with potentially corrosive materialssuch as cleaning agents, sweat, water, alcohol, or the like. If thehousing 104 is to be processed after the second molded elements 600 areformed, a material that can withstand anodizing processes, heating, orpolishing may be selected. For example, after the housing 104 is formed,including forming both the first and second molded elements 400, 600,the exterior surface of the housing 104 may be polished. Thus, thesecond molded elements 600 typically withstand such a polishing processand also take on a smooth, polished surface itself.

The material may also be selected based on its ability to be pigmentedor dyed to certain colors. For example, a dark material may not be ableto be colored to a shade of white, which may be desirable for somehousings. Also, because the second molded elements 600 form cosmeticsurfaces of the housing 104, it may be preferable for the material todent or deform slightly, rather than crack or shatter, when the device100 is dropped or otherwise subjected to a potentially damaging force.Thus, a material that is not prone to brittle failure may be selectedfor the second molded elements 600. Non-limiting examples of materialsthat may be used to form the second molded elements 600 includepolyether ether ketone, polysulfone, polyphenylsulfone,polyaryletherketone, polyetherimide, and polyethersulfone.

FIG. 7 is a partial cross-sectional view of the housing 104 taken alongline 7-7 in FIG. 4, illustrating how a boss 408 mechanically engages thefirst molded element 400-1 to couple the top portion 202 to the firstmolded element 400-1. The mechanical engagement between the boss 408(and/or a screw 702 held by the boss) and the first molded element 400-1couples the top portion 202 to the first molded element 400-1. Becausethe first molded element 400-1 is also coupled to the body portion viaother interlock features, as described herein, the engagement betweenthe boss 408 and the first molded element 400-1 results in the topportion 202 being coupled to the body portion 200.

A recess 704 receives the second molded element (not shown) that forms aportion of the exterior surface of the housing 104. The first moldedelement 400-1, as molded, may form a bottom surface of the recess 704(e.g., the first molded element 400-1 is molded to its final shape,which at least partially defines the recess, in a single molding orforming process). Alternatively, the first molded element 400-1 may beprocessed after molding to form the recess 704. For example, aftermaterial is introduced into the gap to form the molded element 400-1,the material may partially or completely occupy the recess 704, andsubsequent processing (e.g., grinding, milling, laser ablation, and thelike) may be used to remove material from the first molded element 400-1to form the recess 704.

The boss 408 includes an angled surface 700 that forms an undercutengaging the first molded element 400-1. In particular, when thematerial forming the first molded element 400-1 is molded into the gapbetween the top portion 202 and the body portion 200, the material flowsinto the space under the angled surface 700. Once the material hardens,the angled surface 700 prevents the first molded element 400-1 fromhorizontally separating from the top portion 202 (with respect to theorientation shown in FIG. 7). Other interlock features and/or structuralcomponents may prevent the first molded element 400-1 and the topportion 202 from moving vertically relative one another, increasing theeffectiveness of the angled surface 700 in retaining the first moldedelement 400-1 and the top portion 202. For example, threads of the screw702 (described herein) may prevent the top portion 202 from movingvertically relative to the first molded element 400-1 (with respect tothe orientation shown in FIG. 7).

As noted above, a screw 702 may be threaded into or otherwise secured ina through-hole 410 of the boss 408. The screw 702 extends below theangled surface 700 and into the first molded element 400-1, thus actingas an interlock feature to prevent the first molded element 400-1 andthe top portion 202 from moving horizontally (and vertically) withrespect to one another. While FIG. 7 depicts a screw, similarfunctionality may be provided by a smooth post, a splined post, or anyother appropriate feature that extends below the angled surface 700 andengages the first molded element 400-1.

The boss 408 need not include both the angled surface 700 and the screw702. For example, the boss 408 may have a horizontal surface in place ofthe angled surface 700 (or a surface angled in an opposite or anotherdirection than the angled surface 700). In such embodiments, the boss408 may provide mechanical engagement between the top portion 202 andthe first molded element 400-1 by the screw 702 alone. Alternatively,the boss 408 may omit the through-hole 410 and the screw 702 entirely,and mechanically engage with the first molded element 400-1 solely withthe angled surface 700 or with any other appropriate shape or feature.

In addition to forming an interlock feature that mechanically engagesthe first molded element 400-1, the boss 408 and/or the screw 702 mayact as an electrical contact point to couple the top portion 202 to anelectrical component of the device 100. For example, where the topportion 202 is an antenna (or part of an antenna), an electricalconnector that is electrically coupled to a radio circuit or componentmay be coupled to the boss 408 by the screw 702. Thus, the top portion202 may be electrically coupled to the radio circuit or component. Thebottom portion 204 may include a similar boss to electrically couple thebottom portion 204 to electrical components of the device 100.

FIG. 8 is a partial cross-sectional view of the housing 104 taken alongline 8-8 in FIG. 4, illustrating various interlock features that maycouple the top portion 202 and/or the body portion 200 to the firstmolded element 400-1. The top portion 202 includes a post 800 thatextends vertically from a surface. During forming of the first moldedelement 400-1, the material of the first molded element 400-1 flowsaround the post 800. When the material hardens, the first molded element400-1 at least partially surrounds the post 800, and the first moldedelement 400-1 is thus prevented from moving horizontally with respect tothe top portion 202 (as oriented in FIG. 8).

The post 800 may have any appropriate shape and/or cross-section. Forexample, the post 800 may have a circular (e.g., a cylindrical post),square, rectangular, or triangular cross-section, or any otherappropriate cross-section. Moreover, the post (and/or any associatedsupporting structures) may be formed in any appropriate way. Forexample, the top portion 202 may include the post 800 as-cast oras-molded. More particularly, a mold that is used to form the topportion 202 may be configured to produce a net (or near-net) shape topportion 202 that includes the post 800. As another example, the post 800may be machined into the top portion 202. As yet another example, thepost 800 may be formed by laser sintering material onto the top portion202 to form the post 800 (e.g., using a laser to sinter powderedmaterial that is built-up on a surface) or bonding a post to the topportion 202. As yet another example, the post 800 may be a separatecomponent that is screwed, threaded, or otherwise attached to the topportion 202.

Like the top portion 202, the body portion 200 may also include aninterlock feature that engages the first molded element 400-1. Forexample, the body portion 200 may include an angled protrusion 802 thatextends away from a surface of the body portion 200 and engages thefirst molded element 400-1. (Instead of or in addition to the angledprotrusion 802, the body portion 200 may include any other protrusion orinterlock feature, such as a post, a cavity, a screw, or the like.) Themechanical engagement between the angled protrusion 802 and the firstmolded element 400-1 prevents or limits the first molded element 400-1from moving horizontally relative to the body portion 200. The angledprotrusion 802 may be formed in any appropriate manner, such as molding,machining, laser sintering, bonding (e.g., adhering an additionalcomponent to the body portion 200) or the like.

FIG. 9 is an expanded view of area 412 of FIG. 4, illustrating adovetail-type interlock feature that couples the first molded element400-1 to the body portion 200. The body portion 200 of the housingincludes a dovetail-shaped recess 900. When the material of the firstmolded element 400-1 is introduced into the gaps, the material may alsobe introduced into the dovetail-shaped recess 900. Once the material iscured, the first molded element 400-1 forms a dovetail 902 that isdisposed in the recess 900, and mechanically couples the first moldedelement 400-1 to the body portion 200.

FIGS. 7-9 illustrate interlock features that may be used to couple boththe top portion 202 and the body portion 200 to the first molded element400-1. Thus, the first molded element 400-1 effectively couples the topportion 202 to the body portion 200 to form the housing 104. The same orsimilar interlocks may be used to couple the bottom portion 204 to thebody portion 200 using the first molded element 400-2 of the jointstructure 206-2.

As noted above, the second molded elements 600 are formed in therecesses 414 and are coupled to the first molded elements 400 and/orportions of the housing 104. For example, the second molded elements 600may mechanically engage interlock features of the first molded elements400 or the housing 104. FIGS. 4 and 6 illustrate one example interlockfeature that may be used to couple the first and second molded elements.In particular, the first molded elements 400 may include cavities 404(FIG. 4) into which the second molded elements 600 may be formed. Thecavities 404 communicate with the recesses 414 via an opening that isnarrower (or otherwise smaller) than the cavity. Portions of the secondmolded elements 600 that are formed in the cavities 404 are thus heldcaptive in the cavities 404, preventing the second molded elements 600from decoupling or being pulled away from the first molded elements 400and the housing 104.

FIG. 10 is a partial cross-sectional view of the housing 104 taken alongline 10-10 in FIG. 6, illustrating other examples of interlock featuresthat mechanically engage the second molded element 600-2 to the housing104. The body portion 200 includes a protrusion 1000 that extends awayfrom a surface of the body portion 200 and into a cavity in which thesecond molded element 600-2 is disposed. During forming of the secondmolded element 600-2, the material of the second molded element 600-2flows around the protrusion 1000. When the material hardens, the secondmolded element 600-2 mechanically engages the second molded element600-2. In particular, the second molded element 600-2 is prevented frommoving at least vertically with respect to the body portion 200 (asoriented in FIG. 10). Accordingly, the second molded element 600-2 isretained to the housing 104 via the protrusion 1000. The protrusion 1000may have any appropriate shape and/or cross-section, such as a circular,square, rectangular, or triangular cross-section, or any otherappropriate shape or cross section.

FIG. 11 is a partial cross-sectional view of the housing 104 taken alongline 11-11 in FIG. 10. In the embodiment shown, the protrusion 1000 issolid. In other embodiments, the protrusion may include one or morethrough-holes (or other cavities, recesses, or the like) that provideadditional mechanical engagement between the body portion 200 and thesecond molded element 600-2.

FIG. 12 is a partial cross-sectional view of the housing 104 taken alongline 10-10 in FIG. 6, illustrating an embodiment of the housing 104where a protrusion 1200 includes a through-hole 1202 into which part ofthe second molded element 600-2 is disposed. In particular, material mayflow into the through-hole 1202 during the forming of the second moldedelement 600-2. FIG. 13 is a partial cross-sectional view of the housing104 taken along line 13-13 in FIG. 12, showing another view of theprotrusion 1200 and the through-hole 1202. The additional mechanicalengagement provided by the through-hole 1202 may increase the securityof the coupling between the second molded element 600-2 and the bodyportion 200. For example, while the protrusion 1000 (FIG. 10) mayprimarily prevent or limit vertical motion of the second molded element600-2 (as oriented in FIG. 12), the protrusion 1200 may prevent or limitboth vertical and horizontal motion of the second molded element 600-2with respect to the body portion 200.

FIG. 14 is a partial cross-sectional view of another embodiment of thehousing 104 taken along line 10-10 in FIG. 6, illustrating anotherexample of an interlock feature with which the second molded element600-2 engages to couple the second molded element 600-2 to the housing104. In the illustrated embodiment, the bottom portion 204 includes arecess 1400 into which a portion of the second molded element 600-2protrudes. In particular, the material of the second molded element600-2 may flow into the recess 1400 during forming of the second moldedelement 600-2, and then harden to form a secure mechanical engagementwith the recess 1400.

The recess 1400 may have any appropriate shape, and may be configured toretain the second molded element 600-2 in the gap by preventing thesecond molded element 600-2 from moving vertically with respect to thehousing 104 (as oriented in FIG. 14). The recess 1400 may be anyappropriate length along the bottom portion 204. For example, the recess1400 may have similar length and height dimensions (where height isvertical and length is into/out of the page), or it may have achannel-shape where the length is longer than the height. In some cases,the recess 1400 may form a channel that extends along substantially anentire surface of the bottom portion 204.

The recess 1400 may be formed in any appropriate manner. For example,the recess 1400 may be part of the bottom portion 204 as-cast oras-molded, without requiring additional post-processing steps to formthe recess 1400. Alternatively, the recess 1400 may be formed into thebottom portion 204 by drilling, milling, machining, laser ablating, orany other appropriate process.

FIG. 15 is a partial cross-sectional view of another embodiment of thehousing 104 taken along line 10-10 in FIG. 6, illustrating an example ofanother interlock feature with which the second molded element 600-2 mayengage to couple the second molded element 600-2 to the housing 104. InFIG. 15, the bottom portion 204 includes a slot 1500 into which aportion of the second molded element 600-2 protrudes. In particular, thematerial of the second molded element 600-2 may flow into the slot 1500during forming of the second molded element 600-2, and then hardenwithin the slot to mechanically engage the second molded element 600-2to the bottom portion 204. The slot 1500 may have any appropriate shape,and functions similar to the recess 1400 to retain the second moldedelement 600-2 in the gap between the housing components. Moreover, theslot 1500 may be formed in any appropriate way and using any appropriatetechnique, such as by molding or casting the bottom portion 204 toinclude the slot 1500, or forming the slot 1500 by milling, machining,laser ablating, grinding, or any other appropriate process.

FIGS. 16A-16C are partial cross-sectional views of another embodiment ofthe housing 104 taken along line 10-10 in FIG. 6, illustrating anexample of an interlock feature with which the second molded element600-2 may engage to couple the second molded element 600-2 to the firstmolded element 400-2. In the illustrated embodiment, the second moldedelement 600-2 is retained to the housing 104 at least partially via amechanical interlock with the first molded element 400-2. A mechanicalinterlock between the second molded element 600-2 and the first moldedelement 400-2 may be used instead of or in addition to mechanicalinterlocks between the second molded element 600-2 and the bottomportion 204 and/or the body portion 200 of the housing 104 (e.g. such asthose discussed above with respect to FIGS. 10-15).

With reference to FIG. 16C, the first molded element 400-2 includes atapered through-hole 1602 into which material of the second moldedelement 600-2 flows during forming of the second molded element 600-2.Once the material hardens, the tapered profile of the through-hole 1602holds the second molded element 600-2 captive to the first moldedelement 400-2, and thus retains the second molded element 600-2 to thehousing 104.

FIGS. 16A-16B illustrate stages of an example manufacturing process forforming the interlock shown in FIG. 16C. In FIG. 16A, the first moldedelement 400-2 is formed between the bottom portion 204 and the bodyportion 200. Forming the first molded element 400-2 may include flowingthe material into a gap between the bottom portion 204 and the bodyportion 200. Prior to flowing the material into the gap, a removableinsert may be placed into a region where the through-hole 1602 is to belocated. When the material is flowed into the gap, it flows around theremovable insert. Once the material has at least partially hardened orcured, the removable insert may be removed, forming a blind hole 1600 inthe first molded element 400-2, as shown in FIG. 16A. The removableinsert may have a draft angle that facilitates removal of the insertfrom the first molded element 400-2. This same draft angle forms thetapered profile of the through-hole 1602 that retains the material ofthe second molded element 600-2 to the first molded element 400-2.

A portion 1604 of the first molded element 400-2 at the blind end of thehole 1600 is then removed in order to create the through-hole 1602.Removing this material may also create or deepen a recess 1606 in theexterior surface of the housing 104 into which the second molded element600-2 is formed. The material may be removed using machining, grinding,abrasive blasting (e.g., sand blasting), laser ablation, laser cutting,or the like. FIG. 16B illustrates the first molded element 400-2 afterthe portion 1604 has been removed.

Once the material is removed to form the through-hole 1602 and therecess 1606, the material forming the second molded element 600-2 may beintroduced into the recess 1606 between the bottom portion 204 and thebody portion 200 such that the material flows at least partially intothe through-hole 1602. Once the material of the second molded element600-2 hardens, the mechanical engagement between the tapered walls ofthe through-hole 1602 and the corresponding tapered surfaces of thesecond molded element 600-2 retains the second molded element 600-2 tothe first molded element 400-2 and within the recess 1606.

The second molded element 600-2 may be molded proud of the body portion200 and the bottom portion 204. Accordingly, material may be removedfrom the second molded element 600-2 to form a substantiallyuninterrupted, seamless, and/or smooth transition between the secondmolded element and neighboring exterior surfaces of the housing 104, forexample, by grinding, machining, polishing, sanding, abrasive blasting,or laser ablating the second molded element 600-2. In some locations ofthe housing 104, the second molded element 600-2 and one or more nearbysurfaces of the housing 104 form a substantially coplanar exteriorsurface of the housing 104. For example, in the area 214 in FIG. 2, thesecond panel 212, the joint structure 206-2 (which may include thesecond molded element 600-2), and the body portion 200 may besubstantially coplanar. Moreover, the seams between the components inthis area (and indeed between any of the joint structures 206 andadjacent housing portions) may lack gaps, grooves, or other surfacediscontinuities or irregularities, such that the exterior surface of thehousing 104 is a continuous and/or smooth surface.

FIGS. 17A-17C are partial cross-sectional views of another embodiment ofthe housing 104 taken along line 10-10 in FIG. 6, illustrating anotherexample of an interlock feature with which the second molded element600-2 may engage to couple the second molded element 600-2 to the firstmolded element 400-2. In the illustrated embodiment, the second moldedelement 600-2 is retained to the housing 104 at least partially with athreaded interlock feature 1700 in the first molded element 400-2 (FIG.17B). The threaded interlock in FIGS. 17A-17C may replace or supplementmechanical interlocks between the second molded element 600-2 and thehousing 104 (e.g., such as those described with respect to FIGS. 10-15).

With reference to FIG. 17B, the first molded element 400-2 includes athreaded hole 1700 into which material of the second molded element600-2 flows during forming of the second molded element 600-2. Once thematerial hardens, the threads of the threaded hole 1700 engage thematerial of the second molded element 600-2, thereby retaining thesecond molded element 600-2 to the first molded element 400-2 and,therefore, the housing 104. While FIGS. 17B-17C show a threaded hole1700, a hole may include interlock features other than threads, such asgrooves, splines, undercuts, recesses, cavities, protrusions, or thelike.

FIGS. 17A-17B illustrate stages of an example manufacturing process forforming the threaded interlock shown in FIG. 17C. In FIG. 17A, the firstmolded element 400-2 has been formed between the bottom portion 204 andthe body portion 200. Forming the first molded element 400-2 may includeflowing the material against or around interlock features of the bottomportion 204, the body portion 200, and/or other portions of the housing104 to retain the first molded element 400-2 to the housing 104, asdescribed herein.

A threaded hole 1700 is then formed in the first molded element 400-2.The threaded hole 1700 may be a blind hole (as shown), or it may be athrough-hole. The threaded hole 1700 may be formed in any appropriateway. For example, a smooth-bore hole may be formed by drilling, milling,chemical etching, laser ablating, or the like. Threads may then be cutinto the sidewall of the smooth hole with a tapping tool or otherappropriate tool or process.

Instead of forming the threaded hole 1700 after forming the first moldedelement 400-2, the first molded element 400-2 may include the threadedhole 1700 in its as-formed shape. For example, a threaded insert may beplaced into the region between the bottom portion 204 and the bodyportion 200 where the threaded hole 1700 is to be located. The materialforming the first molded element 400-2 is then flowed into the space andaround the threaded insert. Once the material has at least partiallyhardened or cured, the threaded insert may be removed by unthreading theinsert from the first molded element 400-2, leaving the threaded hole1700 in the first molded element 400-2.

Once the threaded hole 1700 is formed, the material forming the secondmolded element 600-2 may be introduced into a recess 1702 between thebottom portion 204 and the body portion 200 such that the material flowsat least partially into the threaded hole 1700. Once the materialhardens, the mechanical engagement between the threads of the threadedhole 1700 and the corresponding threaded surfaces of the second moldedelement 600-2 retain the second molded element 600-2 to the first moldedelement 400-2 and within the recess 1702. In some cases, the secondmolded element 600-2 is molded proud of neighboring exterior surfaces ofthe body portion 200 and the bottom portion 204 and is further processedto form a substantially uninterrupted, seamless, and/or smoothtransition between the second molded element 600-2 and neighboringexterior surfaces of the housing 104, as described above.

FIG. 17D is a partial cross-sectional view of another embodiment of thehousing 104 taken along line 10-10 in FIG. 6, illustrating a combinationof interlock features that together couple the second molded element600-2 to the housing 104 (e.g., the bottom portion 204), couple thesecond molded element 600-2 to the first molded element 400-2, andcouple the second molded element 600-2 to the housing 104 (e.g., thebottom portion 204). In particular, the first molded element 400-2engages an undercut 1710 in the bottom portion 204 of the housing 104.The undercut 1710 prevents the first molded element 400-2 fromhorizontally separating from the bottom portion 204 (with respect to theorientation shown in FIG. 17D), and also thereby couples the bottomportion 204 to the body portion 200.

The second molded element 600-2 is molded into a cavity that is formedpartially by the first molded element 400-2 (e.g., the wall 1708) andpartially by the bottom portion 204 of the housing 104 (e.g., the wall1706). Thus, the interlock feature is formed by both the housing 104 andthe first molded element 400-2. The angle of the walls 1706, 1708prevent the second molded element 600-2 from vertically separating fromthe first molded element 400-2 (with respect to the orientation shown inFIG. 17D). The walls 1706, 1708 may be formed in any appropriate manner.For example, they may be machined into the bottom portion 204 and thefirst molded element 400-2 after the first molded element 400-2 ismolded into the gap between the bottom portion 204 and the body portion200.

The geometry of the walls 1706, 1708 as shown in FIG. 17D are merelyexamples, and any other geometries or interlocks that are formed by boththe first molded element 400-2 and the housing 104 may be used. Forexample, instead of the angled walls 1706, 1708, the interlock may be athreaded hole that is formed partly in the bottom portion 204 of thehousing 104, and partly in the first molded element 400-2. For example,after the first molded element 400-2 is molded, a hole may be drilledand threaded at an interface between the first molded element 400-2 andthe bottom portion 204 of the housing 104. The resulting threaded holeis defined in part by the bottom portion 204 and in part by the firstmolded element 400-2.

The second molded element 600-2 may also be coupled to the housing 104via an interlock feature formed in the housing 104 alone. For example,the bottom portion 204 of the housing 104 includes a slot 1704 intowhich a portion of the second molded element 600-2 protrudes. Inparticular, the material of the second molded element 600-2 may flowinto the slot 1704 during forming of the second molded element 600-2,and then harden within the slot to mechanically engage the second moldedelement 600-2 to the bottom portion 204.

While FIG. 17D illustrates a combination of interlock features, it ismerely one example combination of features that may be used. Forexample, the slot 1704 may be replaced (or supplemented) by any otherinterlock feature that is formed in the housing 104 to couple to thesecond molded element 600-2 (e.g., the recess 1400 in FIG. 14).Similarly, the undercut 1710 may be replaced (or supplemented) by anyother interlock feature that is configured to couple the first moldedelement 400-2 to the housing 104 (e.g., the boss 408 in FIGS. 4, 7).Moreover, any of the interlock structures shown in FIG. 17D may be usedindependently of any others.

Instead of or in addition to the interlocks described above for couplingthe second molded element 600-2 to the first molded element 400-2, firstand second molded elements may be coupled to one another by adhesion.For example, an adhesive may be applied to the first molded elements 400(e.g., on the surfaces of the first molded elements that form thebottoms of the recesses 414) before the second molded elements 600 aremolded into the recesses 414. Thus, the second molded elements 600 mayadhere to the first molded elements 400 with the adhesive. As anotherexample, a solvent may be applied to the first molded elements 400 toallow the second molded elements 600 to chemically bond directly to thefirst molded elements 400. As yet another example, the material of thesecond molded elements 600 may be configured to chemically attack thesurface of the first molded elements 400 such that the materials of thefirst and second molded elements cure together to form a monolithicstructure. As yet another example, the first molded elements 400 may beprocessed to form a rough or textured surface (e.g., by sanding, sandblasting, grinding, laser ablating, chemical etching, or the like) thatfacilitates adhesion between the first and second molded elements.Similarly, nano-molding technology may be used to form small (e.g.,nano-scale or micro-scale) features on the surfaces of the first moldedelements 400, to which the second molded elements 600 anchor when moldedover the first molded elements 400. The foregoing techniques may also beused to facilitate adhesion between portions of the housing 104 (e.g.,the top and bottom portions 202, 204 and the body portion 200) and thefirst and second molded elements.

The interlock features described above, as well as their locations onthe various housing components and joint structures, are examples.Embodiments may use various different combinations of the interlockfeatures described, may place the interlock features in locations otherthan those described or depicted herein, and/or may use multipleinstances of (or omit) any of the interlock features described. Forexample, interlock features described as being part of the top portion202 may instead or additionally be part of the body portion 200.Moreover, interlock features that are described above for coupling asecond molded element 600 to a first molded element 400 may instead orin addition be used to couple a first molded element 400 to the housing104. Such variations are within the scope of the ideas presented herein.

FIGS. 7-17D, described above, illustrate various interlock features thatmay be used to couple joint structures to a housing of an electronicdevice, and to couple various portions of a housing together to form acomplete housing structure. Joint structures may also include featuresthat help strengthen or buttress more delicate or more critical portionsof the joint structures, and to help increase the overall durability andstructural integrity of the housing.

FIG. 18 is a partial exploded view of the housing 104 showing the jointstructure 206-1 where the second molded element 600-1 is removed fromthe first molded element 400-1. The body portion 200 and the top portion202 each include a flange 1800, 1802, respectively. The flanges of thehousing portions define a frame that is adapted to receive a transparentcover (e.g., a glass or plastic component, or an assembly includingmultiple layers of glass, plastic, coatings, or the like) of the device100. The second molded element 600-1 includes a tooth 1804 or othermember or protrusion that extends past a ledge 1806 of the second moldedelement and bridges a gap between the flanges 1800 and 1802, thusforming a portion of the frame. The second molded element 600-1 alsoincludes a guide structure (or support structure) 1808 that supportsand/or strengthens the tooth 1804 (or other member or protrusion), andis configured to bias the second molded element 600-1 towards aninterior of the housing 104 to prevent or reduce damage to the secondmolded element 600-1 in the event of an impact.

In FIG. 18, the guide structure 1808 protrudes from a side of the secondmolded element 600-1 (or both sides, as shown). The cavity 404 (FIG. 4)in first molded element 400-1 includes a corresponding shape or featureinto which the guide structure 1808 is disposed when the first andsecond molded elements are coupled together. In particular, because thesecond molded element 600-1 is molded into the gap between the housingcomponents and into the cavity 404, the shape of the recess and thecavity 404 will determine the shape of the second molded element 600-1,including the guide structure 1808. Thus, the guide structure 1808 (andindeed any of the guide structures described herein) may be formed bythe process of molding the second molded element 600-1 into the gapbetween the housing components and against the first molded element400-1.

By including the guide structure 1808 near the tooth 1804, the tooth1804 (or other member or protrusion) may be stronger and more resistantto breakage than if no guide structure were included (e.g., if theportion of the second molded element 600-1 that extends from the tooth1804 to the ledge 1806 was the same width as the tooth 1804). Forexample, when the device 100 is dropped or otherwise subjected to animpact, the top portion 202 and the body portion 200 may be pressedtogether, thus narrowing the gap between the components and resulting inthe joint structure 206-1 being compressed. This narrowing of the gapand resulting compression on the joint structure 206-1 may cause thetooth 1804 to crack, break, or otherwise become damaged. The addition ofthe guide structure 1808 near the tooth 1804 increases the strength ofthe second molded element 600-1 in the vicinity of the tooth 1804, andthus may reduce the likelihood of or prevent damage to the tooth 1804 inthe event of a drop or other potentially damaging impact.

Also, the guide structure 1808 may act as a guide such that when thesecond molded element 600-1 is compressed between the housing componentsas a result of the narrowing of the gap between the housing components,the tooth 1804 (or other member or protrusion) is drawn or biasedtowards the interior of the housing 104, as shown by arrow 1810, ratherthan forced outwards, towards the exterior of the housing 104. Inparticular, if the tooth 1804 is forced outwards, it may be more likelyto break than if it is drawn towards the interior of the housing 104.Thus, when the housing portions are forced together, the sides of thecavity 404 of the first molded element 400-1 will press against theguide structure 1808. Because the guide structure 1808 is wider at theend near the interior of the housing 104, the pressure against the guidestructure 1808 will result in the tooth 1804 (and surrounding areas)being forced toward the housing 104 in the direction of the arrow 1810.

It is not necessary that the tooth 1804 actually moves or deflectstoward the interior of the housing 104 for the guide structure 1808 tobe effective. Indeed, as the second molded element 600-1 may be rigidlyheld in the gap between the housing components, it may be unable to movefreely. Nevertheless, the shape of the guide structure 1808 translates acompression force into an inward force rather than an outward force, thelatter being more likely to result in damage to the tooth 1804.

FIG. 19 is a partial exploded view of the housing 104 showing the jointstructure 206-1 where the second molded element 600-1 is removed fromthe first molded element 400-1. A guide structure (or support structure)1900 protrudes from a side of the second molded element 600-1. The guidestructure 1900 has a rounded shape that is similar to the guidestructure 1808, but does not extend to a top surface of the ledge 1806.The guide structure 1900 strengthens the tooth 1804 and tends to drawthe tooth 1804 towards the interior of the housing 104, as describedwith respect to the guide structure 1808.

The first molded element 400-1 includes a pocket 1902 in which the guidestructure 1900 is disposed when the first and second molded elements arecoupled together to form the joint structure 206-1. The pocket 1902includes an undercut in the material of the first molded element 400-1,and communicates with the cavity 404. The pocket 1902 may be molded intothe first molded element 400-1 during forming of the first moldedelement 400-1, or it may be formed by machining, grinding, laserablating, or otherwise removing material from the first molded element400-1 after it is formed. The guide structure 1900 may be formed duringthe molding of the second molded element 600-1 by introducing materialinto the gap between the housing portions and into the cavity 404 andthe pocket 1902. The cured material forms the second molded element600-1, and the guide structure 1900 mechanically engages the pocket1902.

FIGS. 20A-20C illustrate another embodiment of a guide structure (orsupport structure) 2000 that protrudes from a side of the second moldedelement 600-1 to support the tooth 1804. The guide structure 2000extends from a side of the tooth 1804 to a side of the ledge portion1806, and is configured to be disposed in a pocket 2002 in the housing104. The pocket 2002 may be formed from cavities in both the firstmolded element 400-1 and the housing 104 (e.g., the top portion 202and/or the body portion 200). In particular, a portion of the pocket2002 may be formed in the top portion 202 of the housing 104, and asecond portion of the pocket 2002 may be formed in the first moldedelement 400-1. The first and second portions communicate with each otherto form a single pocket 2002 in which the guide structure 2000 isformed. The pocket 2002 and the guide structure 2000 may form a roundedbevel shape. For example, an outer edge of the guide structure 2000 mayextend along a rounded path from a curved member 2004 to the ledgeportion 1806. Moreover, a top surface of the guide structure 2000 (asoriented in FIG. 20B) may extend away from the curved member 2004 andfrom a top surface of the ledge portion 1806 at an angle, while a bottomsurface of the guide structure extends substantially parallel to a topsurface of the ledge portion 1806.

The pocket 2002 may be formed by removing material from the housingportions and the first molded element 400-1 (e.g., by grinding, cutting,machining, or the like) after the first molded element 400-1 is formed.The guide structure 2000 may be formed during the molding of the secondmolded element 600-1 by introducing material into the gap between thehousing portions and into the cavity 404 and the pocket 2002. The curedmaterial forms the second molded element 600-1, and the guide structure2000 mechanically engages the pocket 2002.

FIG. 21A is a partial exploded view of the housing 104 showing the jointstructure 206-1 where the second molded element 600-1 is removed fromthe first molded element 400-1. FIG. 21B is a partial view of the secondmolded element 600-1 in which a gusset 2100 is disposed on an interiorradius of a curved member 2104 of the second molded element 600-1. Thegusset 2100 is configured to be disposed within a groove 2102 formed inthe first molded element 400-1. The gusset 2100 may strengthen and/orsupport the curved member 2104 and the tooth 1804 by increasing theamount of material available to support stresses imparted on thoseportions of the second molded element 600-1. Moreover, the gusset 2100may stiffen the curved member 2104 such that compression of the secondmolded element 600-1 (e.g., caused by dropping the device 100) does notresult in damaging deflection of the curved member 2104 and/or the tooth1804.

Like other features described herein, the groove 2102 may be moldeddirectly into the first molded element 400-1, or formed after molding byremoving material by grinding, milling, laser ablating, or the like.Moreover, the gusset 2100 may be formed by molding the material of thesecond molded element 600-1 into the groove 2102.

FIGS. 22A-22B illustrate another example of a gusset 2200 that maysupport a curved member 2204 of the second molded element 600-1. Whereasthe gusset 2100 (FIGS. 21A-B) extends only part of the width of thecurved member 2104, the gusset 2200 in FIG. 22B extends the full widthof the curved member 2204.

FIGS. 23A-23B illustrate an embodiment of the second molded element600-1 that includes a chamfer 2300 at a joint between the tooth 1804 andthe ledge portion 1806 of the second molded element 600-1. The chamfer2300 extends from a side of a cantilevered part of the tooth 1804 to asurface of the ledge portion 1806. The chamfer 2300 decreases the amountof material that extends unsupported above the ledge portion 1806, andthus increases the strength and/or stiffness of the tooth 1804.Accordingly, the chamfer may prevent chipping or breaking of the tooth1804 if the device 100 is dropped or otherwise subjected to potentiallydamaging forces.

FIG. 24 depicts a flow chart of a method 2400 of forming a housing foran electronic device, such as the housing 104. At operation 2402, afirst molded element is formed between a first housing component and asecond housing component (each forming a portion of the housing) tocouple the first and second housing components. For example, first andsecond housing components may be introduced into a mold that holds thehousing components such that they are separated by a gap. A firstmaterial (e.g., nylon, polyether ether ketone, etc.) may then beintroduced into the mold such that the material flows into the gap andagainst first and second interlock features of the first and secondhousing components, respectively. The material may then be cured orotherwise hardened to form a rigid component comprising the first andsecond housing components joined by the first molded element.

The mechanical engagement between the first molded element and theinterlock features couples the first molded element to the first andsecond housing components, and thus couples the first and second housingcomponents to each other. Example interlock features are discussedherein.

At operation 2404, an interlock feature is optionally formed in thefirst molded element. For example, a hole (e.g., a threaded hole or atapered hole), recess, protrusion, or the like, may be formed in thefirst molded element after the first molded element is at leastpartially cured. The interlock feature may be formed by removingmaterial (for example, by milling, grinding, drilling, threading, laserablating, or the like) and/or by adding material (for example, by lasersintering, bonding, mechanical joining, or the like).

Alternatively or additionally, an interlock feature may be formed in thefirst molded element during molding of the first molded element. Forexample, the mold that holds the housing components may includeprotrusions, voids, or other features that will mold the interlockfeatures into the first molded element when the first material isintroduced into the mold.

At operation 2406, a second molded element is formed. For example, thesecond molded element may be formed by introducing a second material(e.g., nylon, polyether ether ketone, etc.) into the gap after the firstmolded element is formed and at least partially cured. Optionally, anadhesive may be applied to the first molded element prior to forming thesecond molded element (e.g., prior to introducing the second materialinto the gap and against the first molded element), such that the secondmolded element is bonded to the first molded element by the adhesive.The second material may completely fill the gap such that the outersurface of the second molded element and the housing (e.g., portions ofthe housing that are next to the second molded element) form asubstantially continuous surface (e.g., they may be coplanar). Thesecond material may then be cured or otherwise hardened.

If the first molded element includes an interlock feature for engagingthe second molded element, forming the second molded element may includeflowing the second material against the interlock in the first moldedelement to mechanically engage the second molded element to the firstmolded element.

While any methods disclosed herein have been described and shown withreference to particular operations performed in a particular order,these operations may be combined, sub-divided, or re-ordered to formequivalent methods without departing from the teachings of the presentdisclosure. Accordingly, unless specifically indicated herein, the orderand grouping of the operations is not a limitation of the presentdisclosure.

The foregoing description, for purposes of explanation, used specificnomenclature to provide a thorough understanding of the describedembodiments. However, it will be apparent to one skilled in the art thatthe specific details are not required in order to practice the describedembodiments. Thus, the foregoing descriptions of the specificembodiments described herein are presented for purposes of illustrationand description. They are not targeted to be exhaustive or to limit theembodiments to the precise forms disclosed. It will be apparent to oneof ordinary skill in the art that many modifications and variations arepossible in view of the above teachings.

What is claimed is:
 1. A housing for an electronic device, comprising: afirst component; a second component separated from the first componentby a gap; a first molded element disposed at least partially within thegap and defining at least a portion of an interlock feature; and asecond molded element disposed at least partially within the gap andmechanically engaging the interlock feature; wherein the firstcomponent, the second component, and the second molded element form aportion of an exterior surface of the housing.
 2. The housing of claim1, wherein the interlock feature mechanically couples the firstcomponent to the second component.
 3. The housing of claim 2, wherein:the interlock feature is a first interlock feature; the first componentdefines a second interlock feature; and the first molded elementmechanically engages the second interlock feature to mechanically couplethe first molded element to the first component.
 4. The housing of claim1, wherein the interlock feature is a protrusion formed in the firstmolded element.
 5. The housing of claim 1, wherein the interlock featureis a recess formed in the first molded element.
 6. The housing of claim5, wherein: the first molded element defines a first portion of theinterlock feature; and the first component defines a second portion ofthe interlock feature.
 7. The housing of claim 1, wherein: the interlockfeature is a through-hole extending from a first surface of the firstmolded element to a second surface of the first molded element; and thefirst surface of the first molded element is adjacent the second moldedelement.
 8. The housing of claim 1, wherein: the first component definesa first exterior surface of the housing; the second component defines asecond exterior surface of the housing; the second molded elementdefines a third exterior surface of the housing; and at least portionsof the first, second, and third exterior surfaces of the housing form asubstantially coplanar surface.
 9. The housing of claim 1, wherein: thefirst molded element comprises a textured surface; and the second moldedelement mechanically engages the textured surface to retain the secondmolded element to the first molded element.
 10. The housing of claim 1,wherein the first molded element has a higher strength than the secondmolded element.
 11. The housing of claim 1, wherein the first componentis an antenna.
 12. A housing for an electronic device, comprising: afirst component; a second component separated from the first componentby a gap; and a joint structure disposed at least partially within thegap; wherein: the first component and the second component compriseflanges defining first and second portions, respectively, of a frameadapted to receive a transparent cover; a tooth of the joint structureextends past a ledge of the joint structure and forms a third portion ofthe frame; and the joint structure includes a support structure thatsupports the tooth.
 13. The housing of claim 12, wherein the supportstructure protrudes from a side of the joint structure.
 14. The housingof claim 13, wherein the support structure extends from a side of thetooth to a side of the ledge.
 15. The housing of claim 13, wherein thesupport structure is disposed in a pocket formed in one of the first orsecond components.
 16. The housing of claim 13, wherein: the jointstructure is a first molded element; the housing further comprises asecond molded element disposed at least partially within the gap andcomprising a pocket formed therein; and the support structure isdisposed in the pocket formed in the second molded element.
 17. Thehousing of claim 16, wherein the support structure and the pocket areshaped such that a narrowing of the gap causes the tooth to be drawntoward the transparent cover.
 18. The housing of claim 12, wherein thesupport structure comprises a chamfer extending from the tooth to theledge.
 19. The housing of claim 12, wherein the joint structurecomprises: a curved member; and a gusset on an interior radius of thecurved member.
 20. A housing for an electronic device, comprising: afirst housing portion forming a first portion of an exterior surface ofthe housing; a second housing portion separated from the first housingportion by a gap and forming a second portion of an exterior surface ofthe housing; and a joint structure disposed in the gap and comprising aguide structure configured to bias at least a portion of the jointstructure toward an interior of the housing in response to a narrowingof the gap.
 21. The housing of claim 20, wherein: the guide structureextends from a side of the joint structure; and the guide structureengages a complementary recess in one of the first or the second housingportions to bias the portion of the joint structure toward the interiorof the housing in response to the narrowing of the gap.
 22. The housingof claim 20, wherein the joint structure further comprises a protrusionthat defines a portion of a frame configured to receive a transparentcover, wherein the guide structure extends from a side of the protrusionto a lower portion of the joint structure.
 23. The housing of claim 20,wherein an outer edge of the guide structure is rounded.
 24. The housingof claim 20, wherein the narrowing of the gap is caused by the housingimpacting a surface.
 25. A method of forming a housing for an electronicdevice, comprising: forming a first molded element, comprising: flowinga material into a gap between a first housing component and a secondhousing component; flowing the material against a first interlockfeature of the first housing component to couple the material to thefirst housing component; flowing the material against a second interlockfeature of the second housing component to couple the material to thesecond housing component; and forming a second molded element in the gapto form an exterior surface of the electronic device.
 26. The method ofclaim 25, wherein: the material is a first material; and the operationof forming the second molded element comprises flowing a second materialagainst a third interlock feature of the first molded element to couplethe second molded element to the first molded element.
 27. The method ofclaim 26, wherein forming the first molded element further comprisesforming the third interlock feature.
 28. The method of claim 26, furthercomprising machining the first molded element to form the thirdinterlock feature.
 29. The method of claim 26, further comprising:forming a hole in the first molded element; and forming threads on asurface of the hole, thereby forming the third interlock feature;wherein the operation of flowing the second material against the thirdinterlock feature comprises flowing the second material into the holeand against the threads to form a threaded post.
 30. The method of claim25, further comprising applying an adhesive to the first molded elementprior to forming the second molded element, wherein the second moldedelement is bonded to the first molded element by the adhesive.